Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets USP Class VI and ISO 10993-5 Specifications.
Two Component Epoxy Resin System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures at Moderately Elevated Temperatures and Chemical and High Temperature Resistance. Passes NASA Low Outgassing Tests.
Room Temperature Curing, Urethane Modified Epoxy Gel-Like System for Sealing and Encapsulation Cures To a Low Shore A Hardness Ideal for Retrievability
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing, Coating and Casting Featuring Excellent Physical Properties and Dimensional Stability with a Remarkably High Glass Transition Temperature Greater Than 180°C.
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Meets NASA Low Outgassing Specification ASTM E595.
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
One Component, Moderate Viscosity LED Curable System Cures Readily and Tack-Free at 405 nm Wavelength up to 1/8 Inch Thick Without Any Oxygen Inhibition.
Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
